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Copyright Plaspro GmbH 2012

TSV depth measurement

Non Destructive and Fast

The Wafer Thickness Sensor (WTS) is an optical, non-destructive, sensor that directly measures the etch depth of vias, without regard to aspect ratio. The high throughput measurements of via depth after the etching of through silicon vias (TSV) will allow timely feedback for process control, process development, and the prevention of process excursions in 3D IC process technology. In this paper, we report the capabilities and limitations of the WTS for the measurement of TSV etched depth. Etch depth measurement results are presented for a variety of vias, including 1μm, 3μm,

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T-ESC®-Technology is based on using an electrostatic field to apply an electrical force on materials of even lower conductivity. The mobile electrostatic carriers (T-ESC®) developed by PCS can build up force.....

Chucking/De-Chucking System ACU 3000

White Knight Fluid Handling is the world leader in zero metal, ultra-high purity fluid handling equipment that supports the Semiconductor, Solar and LED display industries. White Knight supports these high tech industries with products that lead the industry in quality through complete in-house manufacturing including raw materials pressing, sintering and precision machining

White Knight Joins the Plaspro Family

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