Copyright Plaspro GmbH 2012
The Wafer Thickness Sensor (WTS) is an optical, non-destructive, sensor that directly measures the etch depth of vias, without regard to aspect ratio. The high throughput measurements of via depth after the etching of through silicon vias (TSV) will allow timely feedback for process control, process development, and the prevention of process excursions in 3D IC process technology.
WaferScan with Wafer Thickness Sensor
APPLICATION FOR TSV
• Measures any diameter with any aspect ratio
• Provides immediate process feedback
• Non-
• Improves yields and equipment utilization
• High speed supports stand alone or in-
MEASUREMENT PERFORMANCE
• Measures isolated TSVs or TSV field
• Measures down to 1um diameter TSV
• Measures various sizes, shapes, densities, etc…
• Measures single profile in seconds or entire wafer in minutes
