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Deposition & Etch Metrology Wet Process Wafer Process

Surface Tension Gradient Dryer (STG)

Substrate Drying with No Watermarks

The Gradient Dryer uses the difference between the surface tension of H2O and IPA to produce a gradient that generates fast and effective substrate drying. Surface tension gradient drying yields substrates that are watermark-free with low particle counts and no feature damage.

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Features


Main Benefits


IPA concentration gradient induces surface tension gradient drying without watermarks.

Cross section of The Surface Tension Gradient Dryer

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