Copyright Plaspro GmbH 2012
Inline chemical heaters are used in wet process manufacturing applications where inline heating is preferred over immersion heating methods. Process Technology inline heaters are manufactured in fluoropolymer and high purity quartz materials. Sizes are range up to 12,000 watts. A large variety of standard and custom configurations are available. Applications include temperatures up to 180 degrees centigrade.
TIH Series Heater
Quartz IR Heater
Chemical Heaters
The Process Technology quartz IR heater utilizes only high-purity quartz wetted surfaces to ensure no process contamination. IR heating lamps provide responsive heating.
With an all-quartz construction, a wide range of SC-1 and SC-2 fluids can be heated including hydrochloric-peroxide, ammonium-peroxide, sulfuric-peroxide, phosphoric acid, sulfuric acid and ultrapure deionized water. A sealed, all fluoropolymer (PTFE) containment housing provides a corrosion-proof, maintenance-free installation and secondary containment. The housing vent connection permits excess heat to be directed out of the wet bench.
The TIH Series in-line fluoropolymer heater is ruggedly designed for the most demanding recirculation or single pass chemical applications and can provide many years of trouble free performance. The heater is typically used in conjunction with a chemical
bath or spray system and external pump/filter. The heater provides high purity heating of chemistry for the semiconductor, FPD, MEMS, biomedical and other industries.
TIH Series Applications Include:
• SC1: ammonium hydroxide (NH5O), and hydrogen peroxide (H2O2)*
• SC2: hydrochloric acid (HCL), and hydrogen peroxide
• Buffered Oxide Etch (BOE) process: hydrofluoric acid (HF) and ammonium fluoride (NH4F)
• Nitride Etch/Strip: phosphoric acid (H3PO4) and water (H2O)
• Various acids such as:
• Hydrochloric (HCL)
• Hydrofluoric (HF)
• Acetic (C2H4O2)*
• Nitric (HNO3)
• Sulfuric (H2SO4).
TIH Series Applications Include:
• SC1: ammonium hydroxide (NH5O), and hydrogen peroxide (H2O2)*
• SC2: hydrochloric acid (HCL), and hydrogen peroxide
• Buffered Oxide Etch (BOE) process: hydrofluoric acid (HF) and ammonium fluoride (NH4F)
• Nitride Etch/Strip: phosphoric acid (H3PO4) and water (H2O)
• Various acids such as:
• Hydrochloric (HCL)
• Hydrofluoric (HF)
• Acetic (C2H4O2)*
• Nitric (HNO3)
• Sulfuric (H2SO4).
