Electro-Static Chucking

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Deposition & Etch Metrology Wet Process Wafer Process

T-ESC® Technology offers safe and easy handling as well as processing of thin and ultra-thin substrates. The basic concept behind this reversible chucking technology involves using electrostatic force to clamp thin and ultra-thin flexible wafers onto robust carriers (T-ESC®). Such wafer-carrier packages can be handled and processed like wafers of standard thickness. Therefore, existing standard cassettes, handling tools, and fabrication equipment can be used without modifications. Warp and bow of thin and ultra-thin substrates are eliminated.

PCS offers different types of carriers (T-ESC®) applicable to a great variety of process applications.

Consisting of :

	Chucking Module CM 3000 as main unit

	Thin Wafer S or ter/Handler as framework

	Aligner Station with two ID readers, reading from back- and front side

	High precision alignment < 100µm

	Touchless unipolar chucking

	Advanced dechucking features

	Smooth chucking for ultra-thin substrates

	Semi Standard Communication SECS/GEM

Technical Data:

Machine D imensions: L x W x H: 1440 x 1485 x 2092 mm
Weight: 1.000 kg

FULLY AUTOMATED CHUCKING UNIT ACU 3000

Stand-alone semi-automated electrostatic chucking/de-chucking unit

Consists of a Chucking Module CM 3000
Equipped with a stand, a special manual load port, and necessary interfaces, e.g. to access a host system

Technical Data

Machine Dimensions L x W x H: 650 x 700 x 1100 mm
Weight 30 kg

STAND-ALONE CHUCKING UNIT SCU 3000

TRANSFER ELECTROSTATIC CARRIER (T-ESC®)